12亿元贷款落地，上海先封科技全力推进CoPoS先进封装产线建设

时间

演讲议题
Thematic Report

演讲嘉宾
Guest speaker

10:00-10:20

铜浆增材制造玻璃TGV电路板技术
Copper Paste Additive Manufacturing Technology for Glass TGV Circuit Boards

华中科技大学温州先进制造技术研究院/温州卓联电子材料有限公司 研究员/CEO  李运钧  
Li Yunjun,CEO,SUPER ELECTRONIC CONNECTION/Researcher,WZ AMI OF HUST

10:20-10:40

核心终端产品芯片方阵以及AI核心芯片高端封装解决方案
Core Terminal Product Chip Matrix & High-End Packaging Solutions for AI Core Chips

江苏芯德半导体科技股份有限公司张中副总经理
Zhang Zhong, Deputy GM,Jiangsu Silicon Integrity Semiconductor Technology

10:40-11:00

SCHMID Solution for Glass Substrate manufacturing 

SCHMID迅得科技（广东）有限公司  Laurent Nicolet

11:00-11:20

TGV激光诱导孔、刻蚀孔与金属化之非破坏性检测
Non-Destructive Inspection System for TGV Laser Modification, Etching, and Metallization

蔚华电子科技(上海)有限公司 执行长 杨燿州
Paul Yang,CEO,Spirox Corporation

11:20-11:40

蓝星有机硅IGBT/SiC功率模块封装解决方案
Lanxing Silicone IGBT/SiC Power Module Packaging Solution

蓝星有机硅资深电子胶技术服务工程师曾静
Zeng Jing, Senior Electronic Adhesive Technical Service Engineer, Bluestar Silicones

11:40-12:00

面向光互连应用的离子交换玻璃基光波导技术
Ion-Exchange Glass-Based Optical Waveguide Technology for Optical Interconnect Applications

浙江大学副教授郝寅雷
Hao Yinlei, Associate Professor, Zhejiang University

12:00-13:40

中午休息

13:40-14:00

先进板级扇出封装创新与应用
Innovation and Application of Advanced Panel-Level Fan-Out Packaging

深圳中科四合科技有限公司赵铁良 市场总监
Zhao Tieliang,Marketing Director,SiPTORY

14:00-14:20

先进封装用玻璃基TGV金属化及复合铜填孔解决方案

深圳市赛姆烯金科技有限公司总经理陈伟元
Chen Weiyuan,President,Thumb Graphene Metallization

14:20-14:40

先进封装TGV和RDL一站式量检测方案
One-stop quantitative inspection solution for advanced packaging TGV and RDL

中电科风华信息装备股份有限公司市场部产品专家 刘明辉
Liu Minghui，Market Department Product Expert，CECFL Information Technology Co., Ltd.

14:40-15:00

先进封装基板玻璃原片的机遇与挑战
Opportunities and Challenges of Glass Substrates for Advanced Packaging

山东力诺医药包装股份有限公司研发总监 张海鹏
Zhang Haipeng, R&D Director, Shandong Linuo Pharmaceutical Packaging Co., Ltd

15:00-15:20

中场休息

15:20-15:40

先进封装C2W混合键合工艺的清洗技术的发展和在玻璃基板上的应用
Development of Cleaning Technology for Advanced Packaging C2W Hybrid Bonding Processes and Its Application on Glass Substrates

杭州沐芯联科技有限公司 创始人严宏 教授
Professor Yan Hong,Founder Muxinlian Technology

15:40-16:00

议题待定
TBC

天津巽霖科技有限公司
Xunlin-Tech

16:00-16:20

TGV 通孔内壁磁控溅射金属种子层的高能脉冲电源选择
Power Supply Selection for HiPIMS Deposition of Metal Seed Layers in TGV Through-Holes

新铂科技（东莞）有限公司/哈尔滨工业大学  田修波 CTO、教授
Xiubo Tian, CTO and Professor, at Xinbo Technology (Dongguan) Co., Ltd. and Harbin Institute of Technology.