北京实力源科技将亮相2026年玻璃基板及封装产业链展览会（8月26-28日深圳）

时间

演讲议题Thematic Report

演讲嘉宾Guest speaker

10:00-10:20

铜浆增材制造玻璃TGV电路板技术Copper Paste Additive Manufacturing Technology for Glass TGV Circuit Boards

华中科技大学温州先进制造技术研究院/温州卓联电子材料有限公司 研究员/CEO 李运钧 Li Yunjun,CEO,SUPER ELECTRONIC CONNECTION/Researcher,WZ AMI OF HUST

10:20-10:40

核心终端产品芯片方阵以及AI核心芯片高端封装解决方案Core Terminal Product Chip Matrix & High-End Packaging Solutions for AI Core Chips

江苏芯德半导体科技股份有限公司张中副总经理Zhang Zhong, Deputy GM,Jiangsu Silicon Integrity Semiconductor Technology

10:40-11:00

SCHMID Solution for Glass Substrate manufacturing 

SCHMID迅得科技（广东）有限公司 Laurent Nicolet

11:00-11:20

TGV激光诱导孔、刻蚀孔与金属化之非破坏性检测Non-Destructive Inspection System for TGV Laser Modification, Etching, and Metallization

蔚华电子科技(上海)有限公司 执行长 杨燿州Paul Yang,CEO,Spirox Corporation

11:20-11:40

蓝星有机硅IGBT/SiC功率模块封装解决方案Bluestar Silicones IGBT/SiC Power Module Packaging Solution

蓝星有机硅资深电子胶技术服务工程师曾静Zeng Jing, Senior Electronic Adhesive Technical Service Engineer, Bluestar Silicones

11:40-12:00

面向光互连应用的离子交换玻璃基光波导技术Ion-Exchange Glass-Based Optical Waveguide Technology for Optical Interconnect Applications

浙江大学副教授郝寅雷Hao Yinlei, Associate Professor, Zhejiang University

12:00-13:40

中午休息

13:40-14:00

先进板级扇出封装创新与应用Innovation and Application of Advanced Panel-Level Fan-Out Packaging

深圳中科四合科技有限公司赵铁良市场总监Zhao Tieliang,Marketing Director,SiPTORY

14:00-14:20

先进封装用玻璃基TGV金属化及复合铜填孔解决方案

深圳市赛姆烯金科技有限公司总经理陈伟元Chen Weiyuan,President,Thumb Graphene Metallization

14:20-14:40

先进封装TGV和RDL一站式量检测方案One-stop quantitative inspection solution for advanced packaging TGV and RDL

中电科风华信息装备股份有限公司市场部产品专家刘明辉Liu Minghui，Market Department Product Expert，CECFL Information Technology Co., Ltd.

14:40-15:00

先进封装基板玻璃原片的机遇与挑战Opportunities and Challenges of Glass Substrates for Advanced Packaging

山东力诺医药包装股份有限公司研发总监张海鹏Zhang Haipeng, R&D Director, Shandong Linuo Pharmaceutical Packaging Co., Ltd

15:00-15:20

中场休息

15:20-15:40

先进封装C2W混合键合工艺的清洗技术的发展和在玻璃基板上的应用Development of Cleaning Technology for Advanced Packaging C2W Hybrid Bonding Processes and Its Application on Glass Substrates

杭州沐芯联科技有限公司创始人严宏教授Professor Yan Hong,Founder Muxinlian Technology

15:40-16:00

议题待定TBC

天津巽霖科技有限公司Xunlin-Tech

16:00-16:20

TGV 通孔内壁磁控溅射金属种子层的高能脉冲电源选择Power Supply Selection for HiPIMS Deposition of Metal Seed Layers in TGV Through-Holes

新铂科技（东莞）有限公司/哈尔滨工业大学 田修波 CTO、教授Xiubo Tian, CTO and Professor, at Xinbo Technology (Dongguan) Co., Ltd. and Harbin Institute of Technology.