Technology as Foundation | Lyric's Through Glass Via (TGV) Laser Equipment Enables Breakthroughs in Domestic Advanced Packaging
As the demands for training and inference of AI large scale models grow exponentially, the computing power density of chips keeps rising. Conventional organic packaging substrates can no longer meet the stringent requirements for high frequency and high speed signal transmission, high density interconnection and high efficiency heat dissipation. Against this backdrop, advanced packaging technology has become a core pathway to sustain improvements in chip performance. As a critical bottleneck for the industrial implementation of glass substrates, Through Glass Via (TGV) technology serves as the core enabler for high speed vertical interconnection between chips.
Leveraging its profound expertise in precision laser processing and motion control, Lyric has successfully overcome core technical challenges such as ultrafast laser energy control, high-precision trajectory tracking, and glass material modification control. Its independently developed TGV laser equipment provides critical equipment support for the development of domestic advanced packaging technology.
Lyric TGV Laser Equipment integrates multiple cutting‑edge technologies to achieve coordinated improvements in processing accuracy, efficiency and material compatibility. Equipped with an industry‑leading ultrafast laser system, it adopts a collaborative architecture of fixed optical path and high‑precision motion platform. Its positioning accuracy is strictly controlled within ±1.3 μm. It can stably adapt to glass substrates with a full thickness range from 0.05 mm to 2.1 mm, and processing dimensions can be customized to meet customers’ production‑line requirements.
To address common industry technical pain points in the processing of brittle glass materials, such as microcracks, rough sidewalls, and perpendicularity deviations, Lyric adopts a process route that combines laser-induced modification with wet etching. By precisely controlling laser pulse energy, duration, and scanning path, a continuous and uniform modified zone is formed inside the glass. Subsequent wet etching produces through-holes with smooth inner walls and excellent perpendicularity, effectively ensuring processing quality and the reliability of subsequent signal transmission.
Lyric's TGV laser equipment integrates core configurations such as an infrared femtosecond laser, a Bessel beam focusing system, and a high-precision vacuum adsorption fixture. It is compatible with large-size glass substrates up to 510 mm × 515 mm and operates stably in a Class 10,000 cleanroom environment. It provides customers with end-to-end technical support, covering process development, parameter optimization, and small-batch trial production.
In the future, Lyric will continue to uphold its original aspiration of "Technology as the Foundation," continue to increase R&D investment, deepen collaborative innovation with upstream and downstream partners in the industrial chain, and contribute to the high-quality development of China's advanced packaging industry.
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企业透视镜
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